WS-446HF 助焊剂是一种坚固耐用、无卤素的水洗助焊剂，旨在为复杂的应用提供简单的解决方案，尤其是为 BGA 球接和倒装芯片工艺的单步清洗提供简单的解决方案。的简单解决方案，特别是那些需要对 BGA 球接和倒装芯片工艺进行单一清洗步骤的应用。它具有强大的活化剂系统，即使在铜 OSP、ENEPIG 和 ENIG 等苛刻的基底金属化上也能促进良好的润湿、 其流变性适用于浸渍倒装芯片应用，以及引脚转移或印刷 BGA 球接应用。球尺寸 0.25mm 及以上的应用。WS-446HF 可减少非湿式开路缺陷、缺失球和电泳缺陷，从而帮助提高产量。 缺陷、缺球和电化学迁移 (ECM)，从而提高生产良率。

 

Cleaning
WS-446HF residue can be cleaned with DI water, or water with
-cleaning: 25°C
(room temperature) to 40°C for >1 minute at 60psi or higher.
Packaging
WS-446HF is available airlessly packaged in 10 and 30cc
syringes, and is also available in jars or cartridges, on customer
request.
Storage
For maximum shelf life, WS-446HF syringes and cartridges

not exceed 30°, WS-446HF should
be allowed to stand for at least 4 hours at room temperature
before using.
Technical Support
Indium Corporation sets the industry standard in providing
rapid response, onsite technical support for our customers
’s team of Technical Support
Engineers can provide expertise in all aspects of materials
science and semiconductor packaging process applications.
Safety Data Sheets
Please refer to the SDS document within the product shipment,
or contact our local team to receive a copy.